maybe they mean "staggered"?

Hard to say, the English is pretty awful.

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Note added at 2 hrs (2015-07-14 15:40:18 GMT)
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or even "staggering" - gets a number of googles in a chip bonding context

Für “staging” bei Einkomponentenklebern scheint sich noch keine deutsche Übersetzung gefunden zu haben:

B-staged epoxy resin is a descriptive term used to define a one component epoxy system, using a latent (low reactivity) curing agent. This unique product can be partially cured (sometimes referred to as “pre-dried”), as an initial stage after being applied onto one substrate/surface. It can, at a later time, be completely cured under heat and pressure.
This is significantly different from a typical A-stage epoxy system that is provided in a one or two component format and, is cured in one step at ambient or elevated temperatures.
http://www.epotek.com/site/files/Techtips/pdfs/tip20.pdf

Many high performance epoxies can be formulated as B-stage systems. A B-stage epoxy is a system wherein the reaction between the resin and the curing agent/hardener is not complete. Due to this, the system is in a partially cured stage. When this system is then reheated at elevated temperatures, the cross-linking is complete and the system fully cures.
http://www.masterbond.com/techtips/b-stage-epoxy-systems

Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.
http://www.google.com/patents/US20150057396

After B-staging has occurred, the SMC may be stored for long periods of time without jeopardizing either its handleability or processability. The sheet also then can be cut into an appropriate size and shape for molding (i.e. it can be made into a charge). The material also can be molded.
http://www.patent-de.com/19991014/EP0467032.html

[0040] ... The first resin must be substantially solid or very highly viscous at the B-staging temperature that is selected, as this gives the best conductivity results. Though not wishing to be bound by theory, it is believed that during B-staging, as the solvent evaporates, the solid resin reaches a concentration exceeding its saturation point within the solvent(s). Since the first resin is solid or highly viscous at this temperature, it partially precipitates out of solution during B-staging, enabling the silver to agglomerate significantly.
https://data.epo.org/publication-server/pdf-document/EP08000...

5. Production method according to one of the preceding claims, characterized in that the complete curing of the adhesive is performed in a later, time-separated from the B-staging process step at a temperature higher than the B-staging process
http://www.google.com/patents/DE102006023168B4?cl=en
5. Herstellungsverfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das vollständige Erhärten des Klebstoffs in einem späteren, vom b-staging-Prozess zeitlich getrennten Schritt bei einer höheren Temperatur als der b-staging-Prozess ausgeführt wird.
http://www.google.com/patents/DE102006023168B4?cl=de

[0010] ... As a result, the already-running crosslinking of the thermosetting resin is abruptly stopped. This process is generally referred to as "B-staging".
http://www.google.sh/patents/DE10360743A1?cl=en
[0010] ... Dadurch wird die bereits ablaufende Vernetzung des duroplastischen Harzes abrupt gestoppt. Dieser Prozess wird im Allgemeinen auch als "B-Staging" bezeichnet.
http://www.google.sh/patents/DE10360743A1?cl=de&hl=de

From this it is the "Staging Speed" n z to calculate for hot glue, so the clock speed of the engine for the additional processing of hot glue: 1 "[cycles Λ sec
http://www.google.je/patents/WO2009156135A1?cl=en

In anderem Kontext gibt es Übersetzungen:

Hieraus ist die "Zuschaltdrehzahl" nz für Heißleim zu berechnen, also die Taktzahl der Maschine für die zusätzliche Verarbeitung von Heißleim: 1 „ [Takte Λ sec
http://www.google.je/patents/WO2009156135A1?cl=de&hl=de

[0075] … The overflow pipe 40 is not more coaxial with the electronics housing 20 But at an offset from the axis point, and it is at the lower end of the screw-in 11 formed air chamber 28 in connection. Therefore, in this case, is the air chamber 28 as a staging area for the overflow crowd 27 the potting compound 25 ' That at the bottom of the air chamber 28 accumulates.
http://www.google.no/patents/DE102007058608A1?cl=en
0075] ... Das Überlaufrohr 40 liegt nicht mehr koaxial zum Elektronikgehäuse 20, sondern an einer gegen die Achse versetzten Stelle, und es steht am unteren Ende mit der im Einschraubstück 11 gebildeten Luftkammer 28 in Verbindung. Daher dient in diesem Fall die Luftkammer 28 auch als Auffangraum für die Überlaufmenge 27 der Vergußmasse 25', die sich am Boden der Luftkammer 28 ansammelt.
http://www.google.no/patents/DE102007058608A1?cl=de&hl=de

Ich würde deshalb "staging" beibehalten, weil es unter Fachleuten so verwendet wird, es aber in Klammern oder als Fußnote erklären (es sei denn, der Kunde hätte dafür einen deutschen Begriff anzubieten).

Domain Industrial structures, Chemical compound
en
Definition an intermediate stage in the reaction of certain thermo-setting resins in which the material swells when in contact with certain liquids and softens when heated,but may not entirely dissolve or fuse
Term B-stage
Term Note see prepreg ,A-stage and C-stage
de Term B-Zustand
http://iate.europa.eu/SearchByQuery.do?method=searchDetail&l...

tech. bonding 45 Verklebung {f}
tech. bonding 23 Kontaktierung {f}
bonding [gluing] 16 Bekleben {n}
http://www.dict.cc/?s=bonding